![]() ![]() The tool also provides direct interfaces with Cadence Sigrity ™, Clarity ™, and Celsius ™ analysis technologies, providing an integrated layout and analysis flow that supports virtually all advanced IC packaging technologies such as complex wire bond, copper pillar, FOWLP, 2.5D, 3D, BGA, and PoP. Our website tells you more about what Integrity Plus Auto Repair offers and what our brand is about. Truly integrated with Cadence OrbitIO ™ system planning, Allegro Package Designer Plus offers complete package implementation capabilities to help you make strategic tradeoffs earlier and with greater confidence.
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